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66AK2H14AAAWA24 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+ARM KeyStone II SoC

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PCB Footprints
66AK2H14AAAWA24 - Texas Instruments PCB footprint - BGA - BGA - 66AK2H12DAAWA24
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3D Models
66AK2H14AAAWA24 - Texas Instruments  - 3D model - BGA - 66AK2H12DAAWA24
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66AK2H14AAAWA24 Details

  • Manufacturer Part Number:

    66AK2H14AAAWA24

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    PLASTIC, FCBGA-1517

  • Pin Count:

    1517

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 1200 GHZ

  • Address Bus Width:

    24

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    156.25 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.75 mm

  • Speed:

    1400 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H14AAAWA24 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' PCB layout guidelines, including using a 4-layer board with a solid ground plane, and placing decoupling capacitors close to the device. Additionally, ensure good thermal management by providing adequate heat sink and airflow.
  • To prevent damage or malfunction, it's essential to follow the recommended power-up and power-down sequences outlined in the datasheet. Ensure that the power supplies are ramped up and down slowly, and that the device is properly reset during power-up.
  • To prevent ESD damage, handle the device by the body or use an anti-static wrist strap, and store it in an anti-static bag or container. Ensure that the workspace and equipment are also ESD-protected.
  • To troubleshoot and debug issues, use the device's built-in debug features, such as the JTAG interface, and utilize Texas Instruments' development tools and software. Consult the datasheet and application notes for guidance on debugging and troubleshooting.
  • Operating the device outside of the recommended operating conditions can lead to reduced performance, reliability, and lifespan. To mitigate potential risks, ensure that the device is operated within the specified temperature, voltage, and frequency ranges, and consider implementing protective measures such as over-voltage protection and thermal monitoring.

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66AK2H14AAAWA24 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image 66AK2H14BAAWA24 Texas Instruments

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