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66AK2L06XCMSA - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 900-FCBGA 0 to 0

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66AK2L06XCMSA - Texas Instruments PCB footprint - BGA - BGA - 66AK2L06XCMSA
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66AK2L06XCMSA - Texas Instruments  - 3D model - BGA - 66AK2L06XCMSA
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66AK2L06XCMSA Details

  • Manufacturer Part Number:

    66AK2L06XCMSA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    900

  • ECCN Code:

    5A002.A

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    25 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.55 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1.05 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    25 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2L06XCMSA Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane and thermal vias to the bottom layer to improve heat dissipation. A thermal pad on the bottom of the package should be connected to the ground plane.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature. Additionally, consider using thermal management techniques, such as heat sinks or fans, to maintain a safe operating temperature.
  • If the internal voltage regulator is not used, the device may not function correctly, and power consumption may increase. It's recommended to use the internal voltage regulator to ensure proper device operation and minimize power consumption.
  • To optimize power consumption, use the power-saving features of the 66AK2L06XCMSA, such as dynamic voltage and frequency scaling, and clock gating. Additionally, consider using low-power modes, such as idle or sleep modes, when the device is not in use.
  • To minimize EMI and ensure EMC, follow proper PCB layout and design practices, such as using shielding, filtering, and grounding techniques. Additionally, consider using EMI filters and shielding components in your design.

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66AK2L06XCMSA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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