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70T3509MS133BPI - Renesas Electronics

Description: The 70T3509M is a high-speed 1024K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3509M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3509MS133BPI - Renesas Electronics PCB footprint - BGA - BGA - BGA256-ren1
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70T3509MS133BPI Details

  • Manufacturer Part Number:

    70T3509MS133BPI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BP256

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    37748736 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    255

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    17 mm

  • Standby Current-Max:

    0.08 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    1.37 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70T3509MS133BPI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • Critical timing parameters include clock frequency, setup and hold times, and signal rise and fall times. Ensure that these parameters are met by using a timing analyzer tool and optimizing the PCB design and component selection accordingly.
  • Follow the recommended power-up and power-down sequences outlined in the datasheet. Ensure that the power supply voltage ramps up and down slowly to prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines, and ensure that the PCB is designed with ESD protection in mind. Follow proper handling and storage procedures to prevent ESD damage.

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70T3509MS133BPI Overview

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70T3509MS133BPI Alternates

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Part Image IDT70T3509M133BPGI Renesas Electronics Corporation

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