Part Image

70V08L15PFG - Renesas Electronics

Description: The 70V08 is a high-speed 64K x 8 Dual-Port Static RAM designed to be used as a stand-alone 512K-bit Dual-Port SRAM or as a combination MASTER/SLAVE Dual-Port SRAM for 16-bit-or-more word systems which results in full speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.

Download 70V08L15PFG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
70V08L15PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PNG100
click to zoom
3D Models
70V08L15PFG - Renesas Electronics  - 3D model - Quad Flat Packages - PNG100
click to zoom

70V08L15PFG Details

  • Manufacturer Part Number:

    70V08L15PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PNG100

  • ECCN Code:

    3A991.b.2.b

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    524288 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    100

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    64KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.003 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.225 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

70V08L15PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP6111) for the 70V08L15PFG. It suggests using a 4-layer PCB with a solid ground plane, placing the device near the center of the board, and using thermal vias to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' guidelines for thermal design and management. This includes using a heat sink, ensuring good airflow, and monitoring the device's junction temperature (Tj) to prevent overheating.
  • The 70V08L15PFG is not hermetically sealed, so it's susceptible to moisture ingress. In high-humidity environments, it's crucial to follow Renesas' recommendations for moisture protection, such as using a conformal coating, and ensuring the device is stored in a dry, clean environment.
  • The 70V08L15PFG is not designed to be radiation-hardened, so it's not suitable for use in radiation-intensive environments. If radiation resistance is required, Renesas offers other products that are specifically designed for such applications.
  • The 70V08L15PFG has built-in ESD protection, but it's still essential to follow Renesas' guidelines for ESD handling and protection during manufacturing, testing, and assembly. This includes using ESD-safe materials, equipment, and procedures to prevent damage to the device.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

70V08L15PFG Overview

Use the download button to access the 70V08L15PFG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 70V08, or try a keyword search, such as SRAMs

Parts related to 70V08L15PFG

Showing 0 results

70V08L15PFG Alternates

Showing results

Image Part Number Model
Part Image 70V08L15PFG Integrated Device Technology Inc

Multi-Port SRAM, 64KX8, 15ns, CMOS, PQFP100

Part Image 7008L15PFG8 Integrated Device Technology Inc

Multi-Port SRAM, 64KX8, 15ns, CMOS, PQFP100

Part Image 7008S15PF8 Integrated Device Technology Inc

Multi-Port SRAM, 64KX8, 15ns, CMOS, PQFP100

Part Image 70V08L15PF Integrated Device Technology Inc

Multi-Port SRAM, 64KX8, 15ns, CMOS, PQFP100

Part Image IDT709089S15PF8 Integrated Device Technology Inc

Dual-Port SRAM, 64KX8, 30ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

For a full list of alternate parts for 70V08L15PFG, check out Findchips.com