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70V631S12BFGI - Renesas Electronics

Description: The 70V631 is a high-speed 256K x 18 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 36-bit-or-more word system. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 36-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each po

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70V631S12BFGI - Renesas Electronics - PCB symbol
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70V631S12BFGI - Renesas Electronics PCB footprint - BGA - BGA - BFG208
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70V631S12BFGI - Renesas Electronics - 3D model - BGA - BFG208
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70V631S12BFGI Details

  • Manufacturer Part Number:

    70V631S12BFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BFG208

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.515 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

70V631S12BFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and design guides (e.g., DG20020). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • The 70V631S12BFGI has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink or a thermal via on the PCB. Follow Renesas' thermal design guidelines (e.g., AN9835) for optimal thermal management.
  • The input clock signal should meet the specifications outlined in the datasheet, including frequency, duty cycle, and jitter. Additionally, ensure the clock signal is clean and free from noise, and use a clock buffer or oscillator that meets Renesas' recommendations.
  • Renesas recommends using an external POR and BOD circuit, such as a voltage supervisor IC (e.g., Renesas' ISL88001), to ensure reliable power-on reset and brown-out detection. Follow the application notes and design guides for implementation details.
  • Follow Renesas' EMC and EMI guidelines (e.g., AN9836) to minimize radiation and susceptibility. Use proper PCB layout, grounding, and shielding techniques, and ensure that the device is operated within the specified frequency range and power supply voltage.

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70V631S12BFGI Overview

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For a full list of alternate parts for 70V631S12BFGI, check out Findchips.com