Part Image

70V659S12BF - Renesas Electronics

Description: The 70V659 is a high-speed 128K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 72-bit-or-more word system. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 72-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each po

Download 70V659S12BF Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
70V659S12BF - Renesas Electronics PCB footprint - BGA - BGA - BFG208-
click to zoom
3D Models
70V659S12BF - Renesas Electronics  - 3D model - BGA - BFG208-
click to zoom

70V659S12BF Details

  • Manufacturer Part Number:

    70V659S12BF

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BF208

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e0

  • Length:

    15 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.465 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    15 mm

70V659S12BF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9793) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • The 70V659S12BF has an internal POR and BOD circuitry. To implement POR, connect the VCC pin to a power supply with a suitable voltage regulator. For BOD, connect the VCC pin to a voltage regulator with a brown-out detection feature or use an external BOD circuit.
  • The 70V659S12BF has an operating temperature range of -40°C to +85°C (industrial grade) and -40°C to +125°C (extended industrial grade). However, it's essential to consider the specific application's requirements and ensure proper thermal management to prevent overheating.
  • To minimize EMI and ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding or filtering components. Additionally, consider using EMI filters or common-mode chokes on the power supply lines.
  • Store the 70V659S12BF in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to +125°C, and the relative humidity should be below 80%. Avoid exposing the device to mechanical stress, vibration, or electrostatic discharge.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

70V659S12BF Overview

Use the download button to access the 70V659S12BF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 70V65, or try a keyword search, such as SRAMs

Parts related to 70V659S12BF

Showing 0 results

70V659S12BF Alternates

Showing results

Image Part Number Model
Part Image 70V659S12BF Integrated Device Technology Inc

Multi-Port SRAM, 128KX36, 12ns, CMOS, PBGA208

Part Image IDT70V659S12BFG8 Integrated Device Technology Inc

Multi-Port SRAM, 128KX36, 12ns, CMOS, PBGA208

Part Image IDT70T659S12BFG8 Integrated Device Technology Inc

Multi-Port SRAM, 128KX36, 12ns, CMOS, PBGA208

Part Image IDT70T659S12BFG Integrated Device Technology Inc

Multi-Port SRAM, 128KX36, 12ns, CMOS, PBGA208

Part Image 70T659S12BFGI8 Integrated Device Technology Inc

Application Specific SRAM, 128KX36, 12ns, CMOS, PBGA208

For a full list of alternate parts for 70V659S12BF, check out Findchips.com