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71256L55TDB - Renesas Electronics

Description: The 71256 5V CMOS SRAM is organized as 32K x 8. The circuit also offers a reduced power standby mode for significant system level power and cooling savings. The low-power (L) version also offers a battery backup data retention capability allowing operation off a 2V battery. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation. Military grade product is available.

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71256L55TDB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - SD28
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71256L55TDB Details

  • Manufacturer Part Number:

    71256L55TDB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Pin Count:

    28

  • Manufacturer Package Code:

    SD28

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-CDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.1475 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    32KX8

  • Output Enable:

    YES

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.0015 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.115 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

71256L55TDB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the VCCIO and VCC cores in a specific order, followed by the AVCC and DVCC supplies.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1 μF to 1 μF, placed as close as possible to the device's power pins. The capacitor selection should be based on the device's operating frequency, power consumption, and PCB layout.
  • Renesas provides guidelines for JTAG interface testing in their device documentation. Engineers can use boundary scan tools, such as JTAG controllers, to access the device's internal registers and perform testing. It's essential to follow the recommended JTAG signal voltage levels and signal integrity guidelines to avoid damaging the device.
  • Renesas provides thermal design guidelines in their application notes, which include recommendations for heat sink selection, thermal interface materials, and PCB design considerations. Engineers should also consider the device's junction temperature (Tj) and ensure that it operates within the specified temperature range to prevent thermal shutdown or damage.

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71256L55TDB Overview

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