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71T75802S133PFG - Renesas Electronics

Description: The 71T75802 2.5V CMOS Synchronous SRAM organized as 1M x 18 (18 Megabit). It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71T75802 contains data I/O, address and control signal registers.

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71T75802S133PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin Plastic Thin Quad Flatpack (PKG100)
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71T75802S133PFG - Renesas Electronics  - 3D model - Quad Flat Packages - 100-Pin Plastic Thin Quad Flatpack (PKG100)
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71T75802S133PFG Details

  • Manufacturer Part Number:

    71T75802S133PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1MX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    2.38 V

  • Supply Current-Max:

    0.195 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71T75802S133PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the 71T75802S133PFG, which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance. It's available on the Renesas website or through their support team.
  • Renesas recommends a specific power sequencing scheme to ensure proper operation of the device. This typically involves powering up the VCC and VDD pins in a specific order, followed by the enable pins. The recommended power sequencing scheme can be found in the device's application notes or through Renesas' support team.
  • The built-in voltage regulator of the 71T75802S133PFG has limitations on its output current, voltage range, and power dissipation. These limitations are not explicitly stated in the datasheet, but can be found in the device's application notes or through Renesas' support team. It's essential to understand these limitations to ensure proper system design and operation.
  • Renesas provides a troubleshooting guide for I2C interface issues, which includes steps to verify the I2C bus configuration, clock frequency, and data transmission. Additionally, Renesas' support team can provide further assistance and guidance to resolve I2C-related issues.
  • Renesas provides thermal design guidelines for the 71T75802S133PFG, including recommendations for heat sink design, thermal interface materials, and PCB layout. These guidelines can help ensure reliable operation in high-temperature environments. Additionally, Renesas' support team can provide further guidance and support for thermal design.

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71T75802S133PFG Overview

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