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71V25761S183PFGI - Renesas Electronics

Description: The 71V25761 3.3V CMOS Synchronous SRAM is organized as 128K x 36 and contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as the 71V25761 can provide four cycles of data for a single address presented to the SRAM.

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71V25761S183PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100--
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71V25761S183PFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100--
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71V25761S183PFGI Details

  • Manufacturer Part Number:

    71V25761S183PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    3.3 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    183 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    CACHE SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.035 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V25761S183PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (Renesas Document No. AP-5053) which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize noise.
  • The 71V25761S183PFGI has a thermal pad on the bottom of the package. Renesas recommends using a thermal interface material (TIM) and a heat sink to dissipate heat. A thermal design guide is available in the Renesas application note (Renesas Document No. AP-5053) which provides detailed information on thermal management.
  • The 71V25761S183PFGI has an operating temperature range of -40°C to +85°C, but it's recommended to operate within -20°C to +70°C for optimal performance and reliability.
  • The 71V25761S183PFGI has a set of configuration registers that can be programmed using a serial interface (SPI or I2C). Renesas provides a programming guide and software tools (such as the Renesas Flash Development Toolkit) to assist with programming and configuration.
  • Renesas recommends a specific power-up sequence to ensure proper device operation. The sequence involves applying power to the VCC pin first, followed by the VCCQ pin, and then the input signals. A detailed power-up sequence is provided in the Renesas application note (Renesas Document No. AP-5053).

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