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71V30L35TFGI - Renesas Electronics

Description: The 71V30 high-speed 1K x 8 Dual-Port Static RAM is designed to be used as a stand-alone 8-bit Dual-Port SRAM. It has two independent ports with separate control, address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature, controlled by CE, permits the on chip circuitry of each port to enter a very low standby power mode.

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71V30L35TFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PPG64 PIN
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71V30L35TFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PPG64 PIN
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71V30L35TFGI Details

  • Manufacturer Part Number:

    71V30L35TFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PPG64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    35 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQFP-F64

  • JESD-609 Code:

    e3

  • Memory Density:

    8192 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    64

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFF

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Voltage-Min:

    3 V

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

71V30L35TFGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Critical timing parameters include clock frequency, clock-to-output delay, and output hold time. Refer to the datasheet for specific values and ensure your design meets these requirements.
  • Follow the recommended power-up and power-down sequences in the datasheet. Ensure a slow voltage ramp-up (typically 1-2 ms) and ramp-down (typically 1-5 ms) to prevent damage.
  • Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 2.5 V or higher. Place them as close as possible to the device's power pins, with a maximum distance of 1 cm.

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71V30L35TFGI Overview

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