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71V65603S133BQG - Renesas Electronics

Description: The 71V65603 3.3V CMOS SRAM is organized as 256K X 36. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65603 contain data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.

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71V65603S133BQG - Renesas Electronics PCB footprint - BGA - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
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71V65603S133BQG - Renesas Electronics  - 3D model - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
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71V65603S133BQG Details

  • Manufacturer Part Number:

    71V65603S133BQG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    165

  • Manufacturer Package Code:

    BQG165

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    BURST COUNTER

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA165,11X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

71V65603S133BQG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (Renesas Document No. AP-5053) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The 71V65603S133BQG has a thermal pad on the bottom of the package. Renesas recommends using a thermal interface material (TIM) and a heat sink to dissipate heat. A thermal design guide is available in the Renesas application note (Renesas Document No. AP-5053).
  • Renesas recommends a specific power-up sequence to ensure proper device operation. The recommended sequence is: VCC, then VDDQ, and finally VREF. This sequence helps prevent latch-up and ensures proper device initialization.
  • Renesas recommends using an external reset circuit with a capacitor and a resistor to ensure a reliable reset signal. The reset signal should be asserted for at least 10ms to ensure proper device reset. A detailed reset circuit design is available in the Renesas application note (Renesas Document No. AP-5053).
  • For high-reliability or automotive applications, Renesas recommends following their guidelines for device selection, PCB design, and manufacturing. Additionally, the device should be operated within the recommended temperature range, and the system should be designed to handle potential faults and errors. Renesas also provides specific documentation and support for automotive and high-reliability applications.

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71V65603S133BQG Overview

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