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71V65603S150BQGI8 - Renesas Electronics

Description: The 71V65603 3.3V CMOS SRAM is organized as 256K X 36. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65603 contain data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.

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71V65603S150BQGI8 - Renesas Electronics PCB footprint - BGA - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
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71V65603S150BQGI8 - Renesas Electronics  - 3D model - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
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71V65603S150BQGI8 Details

  • Manufacturer Part Number:

    71V65603S150BQGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    165

  • Manufacturer Package Code:

    BQG165

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    3.8 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    150 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA165,11X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.06 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.345 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

71V65603S150BQGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP-6433) for the 71V65603S150BQGI8. It's essential to follow this guide to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • The 71V65603S150BQGI8 has a thermal pad on the bottom of the package. To ensure proper thermal management, it's recommended to use a thermal interface material (TIM) and attach a heat sink to the thermal pad. The heat sink should be designed to dissipate heat effectively, and the TIM should have a thermal conductivity of at least 1 W/m-K.
  • Renesas recommends a specific power-up sequence to ensure proper device operation. The sequence is: VCC, then VDDQ, and finally VREF. The power-up sequence should be controlled to prevent voltage overshoots and ensure that the device powers up correctly.
  • To troubleshoot JTAG interface issues, check the JTAG clock frequency, ensure that the TCK pin is not left floating, and verify that the JTAG signals are not corrupted by noise or EMI. Also, consult the Renesas documentation for specific JTAG interface requirements and troubleshooting guidelines.
  • When using the 71V65603S150BQGI8 in a high-reliability or safety-critical application, it's essential to follow Renesas' guidelines for fault tolerance, error detection, and correction. Additionally, consider implementing redundant systems, error correction codes, and fail-safe mechanisms to ensure the system's integrity and reliability.

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