Part Image

7201LA30DB - Renesas Electronics

Description: The 7201 is a 512 x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

Download 7201LA30DB Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
7201LA30DB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - CD28-
click to zoom

7201LA30DB Details

  • Manufacturer Part Number:

    7201LA30DB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    0.600 INCH, CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CD28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    30 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    25 MHz

  • Cycle Time:

    40 ns

  • JESD-30 Code:

    R-GDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.211 mm

  • Memory Density:

    4608 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    512X9

  • Output Enable:

    NO

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.0009 A

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

7201LA30DB Overview

Use the download button to access the 7201LA30DB schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like 7201L, or try a keyword search, such as FIFOs

Parts related to 7201LA30DB

Showing 0 results

7201LA30DB Alternates

Showing results

Image Part Number Model
Part Image 5962-8986305YX Teledyne e2v

FIFO, 512X9, 30ns, Asynchronous, CMOS

Part Image 5962-8753101XX Renesas Electronics Corporation

FIFO, 4KX9, 120ns, Asynchronous, CMOS, CDIP28

Part Image 5962-8753101XA Integrated Device Technology Inc

FIFO, 512X9, 30ns, Asynchronous, CMOS, CDIP28

Part Image IDT7201SA30TCB Integrated Device Technology Inc

FIFO, 512X9, 30ns, Asynchronous, CMOS, CDIP28

Part Image IDT7201LA30DGB Renesas Electronics Corporation

FIFO, 512X9, 30ns, Asynchronous, CMOS, CDIP28

For a full list of alternate parts for 7201LA30DB, check out Findchips.com