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7201LA50DB - Renesas Electronics

Description: The 7201 is a 512 x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7201LA50DB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - CD28-
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7201LA50DB Details

  • Manufacturer Part Number:

    7201LA50DB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    0.600 INCH, CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CD28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    50 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    15 MHz

  • Cycle Time:

    65 ns

  • JESD-30 Code:

    R-GDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.211 mm

  • Memory Density:

    4608 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    512X9

  • Output Enable:

    NO

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.0009 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

7201LA50DB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal vias, thermal pads, and heat sink design considerations to ensure optimal thermal performance.
  • The 7201LA50DB has a built-in overcurrent protection feature, but it's recommended to add external overcurrent protection circuitry, such as a fuse or a current sense resistor, to provide additional protection against overcurrent conditions.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN), and then the enable signal (EN). This sequence helps prevent unwanted startup conditions and ensures proper device operation.
  • To troubleshoot output voltage regulation issues, check the input voltage, output voltage, and feedback voltage (VFB) using an oscilloscope or a multimeter. Verify that the output voltage is within the specified range and that the feedback voltage is properly connected to the output voltage divider network.
  • The maximum junction temperature (Tj) for the 7201LA50DB is 150°C. It's essential to ensure that the device operates within the recommended temperature range to prevent thermal shutdown and ensure reliable operation.

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7201LA50DB Overview

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