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7202LA12SOG - Renesas Electronics

Description: The 7202 is a 1K x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7202LA12SOG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PEG28
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7202LA12SOG - Renesas Electronics  - 3D model - Small Outline Packages - PEG28
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7202LA12SOG Details

  • Manufacturer Part Number:

    7202LA12SOG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    28

  • Manufacturer Package Code:

    PEG28

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    12 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    50 MHz

  • Cycle Time:

    20 ns

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    18.3642 mm

  • Memory Density:

    9216 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.5

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.048 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    8.763 mm

7202LA12SOG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the recommended temperature range (–40°C to 125°C).
  • Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 10 V or higher. Place them as close as possible to the device's power pins, with a maximum distance of 1 cm.
  • Implement ESD protection using TVS diodes or ESD arrays at the PCB level. Ensure the protection devices are rated for the maximum voltage and current of the application.
  • Power sequencing should follow the recommended power-up sequence in the datasheet. Ramp-up times should be slower than 10 ms to prevent inrush currents and ensure reliable operation.

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7202LA12SOG Overview

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Part Image IDT7202LA12SO Rochester Electronics LLC

FIFO, 1KX9, 12ns, Asynchronous, CMOS, PDSO28

Part Image 7202LA12SO Integrated Device Technology Inc

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Part Image IDT7202LA12SOG Renesas Electronics Corporation

FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDSO28

Part Image IDT7202LA12SO8 Integrated Device Technology Inc

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Part Image IDT7202LA12SO Integrated Device Technology Inc

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