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7202LA12SOG8 - Renesas Electronics

Description: The 7202 is a 1K x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7202LA12SOG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PEG28
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7202LA12SOG8 - Renesas Electronics  - 3D model - Small Outline Packages - PEG28
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7202LA12SOG8 Details

  • Manufacturer Part Number:

    7202LA12SOG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    28

  • Manufacturer Package Code:

    PEG28

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    12 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    50 MHz

  • Cycle Time:

    20 ns

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    18.3642 mm

  • Memory Density:

    9216 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.5

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.048 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    8.763 mm

7202LA12SOG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN1796) and thermal design guides. It's essential to follow these guidelines to ensure optimal thermal performance and prevent overheating.
  • Renesas provides a Secure Boot and Firmware Encryption Guide (e.g., R01AN4461) that outlines the steps to implement secure boot and firmware encryption on the 7202LA12SOG8. This includes using the built-in cryptographic accelerators and following specific programming and configuration guidelines.
  • The internal oscillator on the 7202LA12SOG8 has a typical accuracy of ±1.5% at room temperature. To improve accuracy, you can use an external crystal oscillator or ceramic resonator, or implement a calibration routine using the MCU's built-in calibration features.
  • To optimize power consumption, use the MCU's low-power modes (e.g., Sleep, Stop, and Hibernate), reduce clock frequencies, and disable unused peripherals. Additionally, use the Renesas Power Consumption Estimator tool to simulate and optimize power consumption in your design.
  • Renesas provides a range of debugging tools, including the E2 Emulator and the CS+ integrated development environment. Use these tools to debug and troubleshoot your design, and follow best practices such as using breakpoints, watching variables, and analyzing trace data.

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