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7203L30TDB - Renesas Electronics

Description: The 7203 is a 2K x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7203L30TDB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - SD28
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7203L30TDB Details

  • Manufacturer Part Number:

    7203L30TDB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SD28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    30 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    25 MHz

  • Cycle Time:

    40 ns

  • JESD-30 Code:

    R-CDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.1475 mm

  • Memory Density:

    18432 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    2KX9

  • Output Enable:

    NO

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.004 A

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

7203L30TDB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and threshold voltage.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, depending on the input voltage and output current requirements. The datasheet provides more detailed guidance on input capacitor selection.
  • Renesas provides EMC guidelines in their application notes, including recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with relevant standards.
  • The 7203L30TDB has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The datasheet provides more detailed information on thermal characteristics and derating curves.

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7203L30TDB Overview

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