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7204L30DB - Renesas Electronics

Description: The 7204 is a 4K x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7204L30DB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - CD28-_--
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7204L30DB Details

  • Manufacturer Part Number:

    7204L30DB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    CD28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    30 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    25 MHz

  • Cycle Time:

    40 ns

  • JESD-30 Code:

    R-CDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.1475 mm

  • Memory Density:

    36864 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    4KX9

  • Output Enable:

    NO

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.004 A

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

7204L30DB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The power-up sequence is critical for the 7204L30DB. Renesas recommends powering up the VCC pin first, followed by the VDD pin, and then the input signals. A specific power-up sequence is provided in the datasheet and application notes.
  • To reduce EMI and noise, Renesas recommends using a multi-layer PCB, placing decoupling capacitors close to the device, and using a common mode choke or ferrite bead on the power lines. Additionally, shielding and grounding techniques can be employed to minimize radiation.
  • Renesas recommends using a voltage supervisor or a dedicated overvoltage protection (OVP) circuit to prevent damage from voltage spikes or surges. The OVP circuit should be designed to trigger at a voltage slightly above the maximum recommended operating voltage.
  • In high-temperature environments, thermal design is critical. Renesas recommends using a heat sink or thermal pad, and ensuring good airflow around the device. The thermal resistance of the PCB and surrounding components should also be considered to prevent thermal runaway.

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7204L30DB Overview

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