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7205L30TDB - Renesas Electronics

Description: The 7205 is a 8K x 9 dual-port FIFO memory that loads and empties data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7205L30TDB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - SD28
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7205L30TDB Details

  • Manufacturer Part Number:

    7205L30TDB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    CERAMIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SD28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    30 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    25 MHz

  • Cycle Time:

    40 ns

  • JESD-30 Code:

    R-CDIP-T28

  • JESD-609 Code:

    e0

  • Length:

    37.1475 mm

  • Memory Density:

    73728 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    8KX9

  • Output Enable:

    NO

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Standby Current-Max:

    0.012 A

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

7205L30TDB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system, such as a heat sink or fan.
  • The input capacitor should be a low-ESR, high-frequency capacitor (e.g., ceramic or film capacitor) with a minimum capacitance of 10uF and a voltage rating of at least 25V. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • To troubleshoot POR issues, check the power supply voltage, ensure the input capacitor is properly connected, and verify that the POR pin is not being pulled low externally. Also, review the device's POR timing and voltage threshold specifications to ensure they are met.
  • Operating the device at a lower voltage than the recommended minimum may result in reduced performance, increased power consumption, and potential reliability issues. It's essential to ensure the device operates within the recommended voltage range to maintain optimal performance and reliability.

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7205L30TDB Overview

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