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72261LA15TFGI - Renesas Electronics

Description: The 72261 is a 16K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperSyn

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PCB Footprints
72261LA15TFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PPG64 PIN
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72261LA15TFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PPG64 PIN
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72261LA15TFGI Details

  • Manufacturer Part Number:

    72261LA15TFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PPG64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    10 ns

  • Additional Feature:

    RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH

  • Clock Frequency-Max (fCLK):

    66.7 MHz

  • Cycle Time:

    15 ns

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Memory Density:

    147456 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16KX9

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.02 A

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

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72261LA15TFGI Overview

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