Description:The 72265 is a 16K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
Clock Frequency-Max (fCLK):
100 MHz
Cycle Time:
10 ns
JESD-30 Code:
S-PQFP-G64
JESD-609 Code:
e3
Length:
14 mm
Memory Density:
294912 bit
Memory IC Type:
OTHER FIFO
Memory Width:
18
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
64
Number of Words:
16384 words
Number of Words Code:
16000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
70 °C
Organization:
16KX18
Output Enable:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LQFP
Package Equivalence Code:
QFP64,.66SQ,32
Package Shape:
SQUARE
Package Style:
FLATPACK, LOW PROFILE
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.6 mm
Standby Current-Max:
0.02 A
Supply Current-Max:
0.08 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
4 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.8 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
14 mm
72265LA10PFG Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide in their application note (R01AN2732EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
The 72265LA10PFG has a specific power-up sequence requirement. Renesas recommends following the power-up sequence described in the datasheet, and using an external power sequencer or a microcontroller to control the power-up sequence if necessary.
While the datasheet specifies an operating temperature range of -40°C to 105°C, Renesas recommends derating the device's performance at higher temperatures. Consult the datasheet and application notes for specific derating guidelines.
Renesas provides an I2C troubleshooting guide in their application note (R01AN2733EU0100) which covers common issues, such as bus contention, clock stretching, and slave address conflicts, along with debugging techniques and tools.
Renesas recommends following standard ESD protection guidelines, such as using ESD-sensitive handling procedures, ESD-protective packaging, and incorporating ESD protection devices (e.g., TVS diodes) in the PCB design.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
72265LA10PFG Overview
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