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7284L12PAG - Renesas Electronics

Description: The 7284 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7284L12PAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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7284L12PAG Details

  • Manufacturer Part Number:

    7284L12PAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    12 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    50 MHz

  • Cycle Time:

    20 ns

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    36864 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

7284L12PAG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable heat sink, and consider using thermal interface materials (TIMs) to improve heat dissipation. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal resistance.
  • The datasheet provides general guidelines for input and output capacitors, but specific requirements may vary depending on the application. Renesas recommends using low-ESR capacitors with a minimum capacitance of 10uF for input and output filtering, and following the recommended capacitor placement and routing guidelines to minimize noise and EMI.
  • Renesas provides troubleshooting guides and application notes that cover common issues like overvoltage, undervoltage, and overcurrent protection. These resources provide step-by-step procedures for identifying and resolving issues, as well as recommendations for designing robust protection circuits.
  • When using the 7284L12PAG in a high-reliability or safety-critical application, it's essential to follow Renesas' guidelines for fault tolerance, redundancy, and fail-safe design. Additionally, consider using redundant components, implementing error detection and correction mechanisms, and following industry-specific standards and regulations (e.g., IEC 61508, ISO 26262).

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7284L12PAG Overview

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