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7285L15PAGI - Renesas Electronics

Description: The 7285 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7285L15PAGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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7285L15PAGI - Renesas Electronics  - 3D model - Small Outline Packages - PAG56-ren1
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7285L15PAGI Details

  • Manufacturer Part Number:

    7285L15PAGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    73728 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

7285L15PAGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN2732EU0100) which includes thermal design considerations, such as placing thermal vias under the package and using a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a heat sink or a fan to reduce the junction temperature.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 4.7uF to 10uF, and the output capacitor (COUT) should be a low-ESR ceramic capacitor with a value between 10uF to 22uF. The capacitor selection should be based on the specific application requirements and operating conditions.
  • To troubleshoot issues with the 7285L15PAGI, start by verifying the input voltage, output voltage, and current consumption. Check for any signs of overheating, such as excessive temperature rise or thermal shutdown. Use an oscilloscope to monitor the output voltage and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, to minimize EMI/EMC issues, follow the recommended PCB layout guidelines, use a shielded enclosure, and implement proper filtering and decoupling. Additionally, ensure that the input and output cables are properly shielded and routed to minimize radiation.

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7285L15PAGI Overview

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