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72T36125L10BB - Renesas Electronics

Description: The 72T36125 is a 256K x 36 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.

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72T36125L10BB - Renesas Electronics PCB footprint - BGA - BGA - BB240
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72T36125L10BB - Renesas Electronics  - 3D model - BGA - BB240
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72T36125L10BB Details

  • Manufacturer Part Number:

    72T36125L10BB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PBGA

  • Pin Count:

    240

  • Manufacturer Package Code:

    BB240

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    4.5 ns

  • Additional Feature:

    ASYNCHRONOUS OPERATION ALSO POSSIBLE

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Cycle Time:

    10 ns

  • JESD-30 Code:

    S-PBGA-B240

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    240

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA240,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.97 mm

  • Standby Current-Max:

    0.01 A

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

72T36125L10BB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP-AN-1143) which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance.
  • Renesas recommends using a power sequencing controller or a dedicated power management IC to ensure proper power-up and power-down sequencing. A detailed example is provided in the application note (AP-AN-1144).
  • Although the datasheet specifies an operating temperature range of -40°C to 125°C, Renesas recommends derating the device's performance at temperatures above 105°C to ensure reliability and longevity.
  • Yes, the 72T36125L10BB is designed to withstand high-vibration environments. However, it's essential to follow Renesas' guidelines for vibration testing and ensure proper PCB mounting and mechanical design to prevent damage.
  • Renesas provides a troubleshooting guide in their application note (AP-AN-1145) which covers common I2C interface issues, such as bus contention, clock stretching, and data corruption. Additionally, using an I2C bus analyzer can help identify and debug issues.

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