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72T36135ML6BBI - Renesas Electronics

Description: The 72T36135M is a 512K x 36 TeraSync 2.5V FIFO memory with clocked read and write controls and a wide extended x 36 bus to allow ample data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data at very high performance. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.

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72T36135ML6BBI - Renesas Electronics PCB footprint - BGA - BGA - BGA240
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72T36135ML6BBI Details

  • Manufacturer Part Number:

    72T36135ML6BBI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PBGA

  • Package Description:

    19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240

  • Pin Count:

    240

  • Manufacturer Package Code:

    BB240

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.8 ns

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Cycle Time:

    6 ns

  • JESD-30 Code:

    S-PBGA-B240

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    240

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA240,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.76 mm

  • Standby Current-Max:

    0.14 A

  • Supply Current-Max:

    0.18 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

72T36135ML6BBI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 72T36135ML6BBI is -40°C to 125°C.
  • The power-up sequence for the 72T36135ML6BBI should follow the recommended power-up sequence in the datasheet, which is VCC, then VTT, and finally CLK. This ensures proper device operation and prevents latch-up.
  • The maximum clock frequency supported by the 72T36135ML6BBI is 166 MHz.
  • To implement clock domain crossing (CDC) with the 72T36135ML6BBI, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The recommended termination scheme for the 72T36135ML6BBI is a series termination with a 33-ohm resistor and a 10-nF capacitor.

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72T36135ML6BBI Overview

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Image Part Number Model
Part Image 72T36135ML6BBG Integrated Device Technology Inc

FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240

Part Image IDT72T36135ML6BBGI Integrated Device Technology Inc

FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240

Part Image 72T36135ML6BB Renesas Electronics Corporation

FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240

Part Image IDT72T36135ML6BBG Renesas Electronics Corporation

FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240

Part Image IDT72T36135ML6BBGI Renesas Electronics Corporation

FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240

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