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72V01L25JGI - Renesas Electronics

Description: The 72V01 is a 512 x 9 dual-port FIFO that operates at Vcc between 3.0V and 3.6V. The device will load and empty data on a first-in/first-out basis. It uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V01L25JGI - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - plg32
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72V01L25JGI - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - plg32
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72V01L25JGI Details

  • Manufacturer Part Number:

    72V01L25JGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PLCC

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLG32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    25 ns

  • Cycle Time:

    35 ns

  • JESD-30 Code:

    R-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    13.97 mm

  • Memory Density:

    4608 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X9

  • Output Characteristics:

    3-STATE

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC32,.45X.55

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.79 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

72V01L25JGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal design considerations. It's essential to follow these guidelines to ensure optimal thermal performance and prevent overheating.
  • The power-up sequence is critical for the 72V01L25JGI. Renesas recommends a specific power-up sequence in their datasheet, which involves powering up the VCC and VDD pins simultaneously, followed by the input signals. Failure to follow this sequence may result in incorrect operation or damage to the device.
  • Operating the 72V01L25JGI beyond the recommended operating temperature range (typically -40°C to 125°C) can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the specified temperature range to maintain its performance and longevity.
  • Renesas provides a troubleshooting guide in their application notes and technical documentation. Engineers can also use tools like logic analyzers and oscilloscopes to debug the issue. Additionally, Renesas offers technical support and FAQs on their website to help resolve common issues.
  • The 72V01L25JGI is a sensitive device that requires proper ESD protection and handling. Renesas recommends following standard ESD handling procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, the device should be handled in a controlled environment with minimal humidity and temperature fluctuations.

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