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72V03L15JG - Renesas Electronics

Description: The 72V03 is a 2K x 9 dual-port FIFO that operates at Vcc between 3.0V and 3.6V. The device will load and empty data on a first-in/first-out basis. It uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V03L15JG - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - plg32
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72V03L15JG - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - plg32
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72V03L15JG Details

  • Manufacturer Part Number:

    72V03L15JG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PLCC

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLG32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PQCC-J32

  • JESD-609 Code:

    e3

  • Length:

    13.97 mm

  • Memory Density:

    18432 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.55 mm

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

72V03L15JG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP6111) for the 72V03L15JG. It suggests using a 2-layer or 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal monitoring and shutdown. Additionally, consider using a thermally conductive material for the PCB and ensuring good airflow around the device.
  • Operating the 72V03L15JG outside the recommended input voltage range (60V to 80V) may affect its performance, efficiency, and reliability. Using a lower input voltage may reduce the output current capability, while a higher input voltage may increase the risk of overvoltage stress and reduce the device's lifespan.
  • Renesas recommends using an external overcurrent protection (OCP) circuit and a short-circuit protection (SCP) circuit to prevent damage to the device. The OCP circuit should be designed to detect overcurrent conditions and disconnect the input power, while the SCP circuit should be designed to detect short-circuit conditions and limit the output current.
  • To minimize EMI and ensure EMC compliance, Renesas recommends following proper PCB layout and design guidelines, using a suitable EMI filter, and implementing shielding and grounding techniques. Additionally, consider using a spread spectrum clock generator to reduce EMI emissions.

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