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72V06L15JG - Renesas Electronics

Description: The 72V06 is a 16K x 9 dual-port FIFO that operates at Vcc between 3.0V and 3.6V. The device will load and empty data on a first-in/first-out basis. It uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V06L15JG - Renesas Electronics - PCB symbol
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72V06L15JG - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - plg32
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72V06L15JG - Renesas Electronics - 3D model - Plastic Leaded Chip Carrier - plg32
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72V06L15JG Details

  • Manufacturer Part Number:

    72V06L15JG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PLCC

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLG32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PQCC-J32

  • JESD-609 Code:

    e3

  • Length:

    13.97 mm

  • Memory Density:

    147456 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    16KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.55 mm

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

72V06L15JG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • Renesas recommends following the derating guidelines in the datasheet, using a heat sink or thermal interface material, and ensuring good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms.
  • Renesas recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The specific capacitor values and types may vary depending on the application and operating conditions. Consult the datasheet and application notes for more information.
  • Renesas provides troubleshooting guides and FAQs on their website, which cover common issues and solutions. Additionally, consult the datasheet and application notes for specific guidance on debugging and troubleshooting techniques.
  • Yes, Renesas recommends following proper EMI/EMC design practices, such as using a shielded enclosure, minimizing loop areas, and using EMI filters or common-mode chokes. Consult the datasheet and application notes for specific guidance on EMI/EMC considerations.

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