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72V2105L10PFG - Renesas Electronics

Description: The 72V2105 is an 256K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.

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72V2105L10PFG Details

  • Manufacturer Part Number:

    72V2105L10PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PNG64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    EASILY EXPANDABLE IN DEPTH AND WIDTH

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Cycle Time:

    10 ns

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP64,.63SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.02 A

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

72V2105L10PFG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.5 mm via diameter for efficient heat dissipation.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Monitor junction temperature (TJ) and adjust the system design accordingly.
  • The 72V2105L10PFG has built-in ESD protection, but additional external protection may be necessary depending on the application. Follow the IEC 61000-4-2 standard for ESD testing and implement protection measures as needed.
  • The 72V2105L10PFG is not specifically designed for radiation-hardened applications. For such applications, consult with Renesas Electronics Corporation or consider alternative radiation-hardened devices.
  • Follow the recommended power-up sequence in the datasheet. Ensure a slow and controlled voltage ramp-up (e.g., 1-2 ms) to prevent damage and ensure reliable operation.

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72V2105L10PFG Overview

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Part Image IDT72V2105L10PFG Integrated Device Technology Inc

FIFO, 256KX18, 6.5ns, Synchronous, CMOS, PQFP64

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Part Image IDT72V2105L10PF9 Integrated Device Technology Inc

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Part Image IDT72V2105L10PFG8 Renesas Electronics Corporation

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Part Image IDT72V2105L10PFG Renesas Electronics Corporation

FIFO, 256KX18, 6.5ns, Synchronous, CMOS, PQFP64

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