Description:The 72V2113 512K x 9/256K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.
AUTO POWER DOWN; RETRANSMIT; IT CAN ALSO BE CONFIGURED AS 512K X 9; ASYNCHRONOUS MODE ALSO POSSIBLE
Cycle Time:
7.5 ns
JESD-30 Code:
S-PBGA-B100
JESD-609 Code:
e1
Length:
11 mm
Memory Density:
4718592 bit
Memory IC Type:
OTHER FIFO
Memory Width:
18
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
100
Number of Words:
262144 words
Number of Words Code:
256000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
256KX18
Output Enable:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LBGA
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.5 mm
Supply Current-Max:
0.035 mA
Supply Voltage-Max (Vsup):
3.45 V
Supply Voltage-Min (Vsup):
3.15 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
11 mm
72V2113L7-5BCGI Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide for the 72V2113L7-5BCGI in their application note (R01AN2722EU0100). It suggests using a 4-layer PCB with a solid ground plane, placing thermal vias under the package, and using a heat sink with a thermal interface material.
To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a heat sink with a thermal interface material, and consider using a thermal protection circuit. Additionally, Renesas provides a thermal design guide (R01AN2722EU0100) that provides more detailed information.
Renesas recommends a power-up sequence of VCC, then VREF, and a power-down sequence of VREF, then VCC. This ensures that the internal voltage regulators are properly initialized and shut down to prevent damage or malfunction.
Renesas recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
The 72V2113L7-5BCGI has a maximum clock frequency of 133 MHz and a maximum data transfer rate of 1066 Mbps. Exceeding these limits may result in reduced performance, increased power consumption, or even device failure.
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72V2113L7-5BCGI Overview
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