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72V2113L7-5BCI - Renesas Electronics

Description: The 72V2113 512K x 9/256K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.

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72V2113L7-5BCI - Renesas Electronics PCB footprint - BGA - BGA - BCG100
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72V2113L7-5BCI Details

  • Manufacturer Part Number:

    72V2113L7-5BCI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Package Description:

    BGA-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    BC100

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    5 ns

  • Additional Feature:

    CAN ALSO CONFIGURABLE AS 512KX9

  • Alternate Memory Width:

    9

  • Clock Frequency-Max (fCLK):

    133.3 MHz

  • Cycle Time:

    7.5 ns

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e0

  • Length:

    11 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

72V2113L7-5BCI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal management guidelines. It's essential to follow these guidelines to ensure optimal thermal performance and prevent overheating.
  • The 72V2113L7-5BCI has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded.
  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. This sequence helps prevent latch-up and ensures proper device operation.
  • To troubleshoot issues with the internal oscillator, check the XTAL1 and XTAL2 pins for proper connection and oscillation. Verify that the oscillator circuit is properly biased and that the crystal resonator is of the correct type and frequency.
  • The ADC has limitations on its conversion rate, resolution, and input range. Refer to the datasheet for specific details, and consider using an external ADC if more precise or faster conversions are required.

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