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72V233L6BC - Renesas Electronics

Description: The 72V233 2K x 9/1K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.

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72V233L6BC - Renesas Electronics PCB footprint - BGA - BGA - BCG100
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72V233L6BC - Renesas Electronics  - 3D model - BGA - BCG100
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72V233L6BC Details

  • Manufacturer Part Number:

    72V233L6BC

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    11 X 11 MM, 1 MM PITCH, BGA-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    BC100

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    4 ns

  • Additional Feature:

    IT CAN ALSO BE CONFIGURED AS 2K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Alternate Memory Width:

    9

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Cycle Time:

    6 ns

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e0

  • Length:

    11 mm

  • Memory Density:

    18432 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA100,10X10,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

Trust Checks

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72V233L6BC Overview

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