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72V235L15TFGI - Renesas Electronics

Description: The 72V235 is a 2K x 18 first-in, first-out memory with clocked read and write controls. It is a 3.3V version of the 72235 FIFO and is applicable for a wide variety of data buffering needs, such as optical disk controllers, Local Area Networks (LANs), and interprocessor communication. It has 18-bit input and output ports. The Read Clock(RCLK) can be tied to the Write Clock for single clock operation or the two clocks can run asynchronous of one another for dual-clock operation.

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72V235L15TFGI Details

  • Manufacturer Part Number:

    72V235L15TFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PPG64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    10 ns

  • Clock Frequency-Max (fCLK):

    66.7 MHz

  • Cycle Time:

    15 ns

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Memory Density:

    36864 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

72V235L15TFGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • A 0.1uF ceramic capacitor should be placed as close as possible to the device's power pins, with a 10uF electrolytic capacitor placed nearby to filter out low-frequency noise.
  • Check the input voltage, output voltage, and current consumption to ensure they are within the recommended ranges. Use an oscilloscope to monitor the voltage regulator's output and input pins for any signs of instability or oscillation.
  • Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. Ensure that the device is operated within the recommended temperature range to ensure optimal performance and reliability.

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72V235L15TFGI Overview

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