Part Image

72V263L6PFG - Renesas Electronics

Description: The 72V263 16K x 9/8K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.

Download 72V263L6PFG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
72V263L6PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PNG80--
click to zoom
3D Models
72V263L6PFG - Renesas Electronics  - 3D model - Quad Flat Packages - PNG80--
click to zoom

72V263L6PFG Details

  • Manufacturer Part Number:

    72V263L6PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    80

  • Manufacturer Package Code:

    PNG80

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    4 ns

  • Additional Feature:

    IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Alternate Memory Width:

    9

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Cycle Time:

    6 ns

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    147456 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    8KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP80,.64SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

72V263L6PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • The 72V263L6PFG has an internal POR and BOD circuit. To implement POR, connect the VCC pin to a power supply with a suitable voltage regulator. For BOD, connect the VCC pin to a voltage regulator with a brown-out detection feature. You can also use external POR and BOD circuits if required.
  • The 72V263L6PFG has an operating temperature range of -40°C to +85°C. However, it's essential to consider the junction temperature (Tj) and ensure it doesn't exceed 150°C during operation.
  • Renesas recommends following proper ESD handling procedures during device handling and assembly. Use ESD-protective packaging, wrist straps, and mats. The device also has internal ESD protection diodes, but external protection devices may be necessary depending on the application.
  • Store the 72V263L6PFG in a dry, cool place with a temperature range of -40°C to +30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

72V263L6PFG Overview

Use the download button to access the 72V263L6PFG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 72V26, or try a keyword search, such as FIFOs

Parts related to 72V263L6PFG

Showing 0 results

72V263L6PFG Alternates

Showing results

Image Part Number Model
Part Image IDT72V263L6PFG Integrated Device Technology Inc

FIFO, 8KX18, 4ns, Synchronous, CMOS, PQFP80

Part Image 72V263L6PFG Integrated Device Technology Inc

FIFO, 8KX18, 4ns, Synchronous, CMOS, PQFP80

Part Image IDT72V263L6PF8 Integrated Device Technology Inc

FIFO, 8KX18, 4ns, Synchronous, CMOS, PQFP80

Part Image 72V263L6PF Integrated Device Technology Inc

FIFO, 8KX18, 4ns, Synchronous, CMOS, PQFP80

Part Image 72V263L6PFG8 Renesas Electronics Corporation

FIFO, 8KX18, 4ns, Synchronous, CMOS, PQFP80

For a full list of alternate parts for 72V263L6PFG, check out Findchips.com