Description:The 72V36110 128K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO's are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes.
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Clock Frequency-Max (fCLK):
166 MHz
Cycle Time:
6 ns
JESD-30 Code:
S-PBGA-B144
JESD-609 Code:
e1
Length:
13 mm
Memory Density:
4718592 bit
Memory IC Type:
OTHER FIFO
Memory Width:
36
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
144
Number of Words:
131072 words
Number of Words Code:
128000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
70 °C
Organization:
128KX36
Output Enable:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA144,12X12,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.97 mm
Standby Current-Max:
0.015 A
Supply Current-Max:
0.04 mA
Supply Voltage-Max (Vsup):
3.45 V
Supply Voltage-Min (Vsup):
3.15 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
TIN SILVER COPPER
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
13 mm
72V36110L6BBG Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
Renesas provides a fault detection and protection guide in their application note (APN) documents. The guide covers fault detection methods, such as overcurrent detection, overvoltage detection, and thermal monitoring. It also provides recommendations for implementing protection mechanisms, such as current limiting and shutdown circuits.
The recommended power-up and power-down sequences can be found in the datasheet or in Renesas' application notes. Generally, it's recommended to power up the device in a specific sequence, such as powering up the voltage regulators before the core voltage, and powering down in the reverse sequence to prevent damage or malfunction.
Renesas provides power-saving techniques and guidelines in their application notes. These include dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, optimizing the system's power management scheme, using low-power modes, and reducing leakage current can also help minimize power consumption.
Thermal design considerations include selecting a suitable heat sink, using thermal interface materials, and designing a thermal management system. Renesas provides thermal design guidelines and recommendations in their application notes, including thermal resistance calculations and junction temperature estimation.
Trust Checks
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Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored
72V36110L6BBG Overview
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