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72V3670L10PFG - Renesas Electronics

Description: The 72V3670 8K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO's are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes.

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72V3670L10PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - pkg128
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72V3670L10PFG Details

  • Manufacturer Part Number:

    72V3670L10PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PKG128

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Cycle Time:

    10 ns

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    294912 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    128

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    8KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

72V3670L10PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN2732EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and setting the overcurrent threshold.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, depending on the input voltage and operating frequency, to ensure stable operation and minimize input ripple.
  • Renesas provides EMC design guidelines in their application note (R01AN2732EU0100), including recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference and ensure compliance with relevant standards.
  • The 72V3670L10PFG has an operating temperature range of -40°C to +125°C, but Renesas recommends derating the device's performance at temperatures above 85°C to ensure reliable operation.

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72V3670L10PFG Overview

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