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72V3672L10PFG8 - Renesas Electronics

Description: The 72V3672 Bidirectional SyncFIFO (clocked) memory is a 3.3V version of the 723672. Two independent 8K x 36 dual-port SRAM FIFOs on board each chip buffer data in opposite directions. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control.

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72V3672L10PFG8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PNG120
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72V3672L10PFG8 Details

  • Manufacturer Part Number:

    72V3672L10PFG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    120

  • Manufacturer Package Code:

    PNG120

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    MAIL BOX

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Cycle Time:

    10 ns

  • JESD-30 Code:

    S-PQFP-G120

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    294912 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    120

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    8KX36

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    TQFP120(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

72V3672L10PFG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AN) documents, which can be found on their website. The guide includes recommendations for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Renesas provides a fault detection and protection guide in their application note (AN) documents, which includes recommendations for overcurrent protection, overvoltage protection, and thermal monitoring. Additionally, the device has built-in fault detection features such as overtemperature detection and output short-circuit protection.
  • The recommended operating temperature range for the 72V3672L10PFG8 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures, and additional thermal management may be required for high-temperature applications.
  • Yes, the 72V3672L10PFG8 is suitable for high-reliability and automotive applications. Renesas provides additional documentation and support for these applications, including AEC-Q100 qualification and PPAP (Production Part Approval Process) support.
  • Renesas provides EMC guidelines and recommendations in their application note (AN) documents, which include suggestions for PCB layout, component selection, and shielding. Additionally, the device has built-in EMC features such as spread spectrum clocking and electromagnetic interference (EMI) reduction.

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