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73623-1001 - Molex

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73623-1001 - Molex  - 3D model
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73623-1001 Details

  • Manufacturer Part Number:

    73623-1001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    0

  • Additional Feature:

    BOX OR TRAY PACKAGING

  • Body Breadth:

    0.49 inch

  • Body Depth:

    0.192 inch

  • Body Length:

    1.6 inch

  • Body/Shell Style:

    RECEPTACLE

  • Contact Arrangement:

    S10C2

  • Contact Finish Mating:

    AU ON NI

  • Contact Finish Termination:

    TIN/LEAD OVER NICKEL

  • Contact Gender:

    MALE

  • Contact Material:

    COPPER ALLOY

  • Contact Resistance:

    15 mΩ

  • Contact Style:

    HYBRID

  • Dielectric Withstanding Voltage:

    500VDC V

  • Durability:

    500 Cycles

  • Insertion Force-Max:

    44.48 N

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Material:

    GLASS FILLED POLYMER

  • Mixed Contacts:

    YES

  • Mounting Type:

    CABLE

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -20 °C

  • Option:

    GENERAL PURPOSE

  • Plating Thickness:

    30u inch

  • Rated Current (Signal):

    1.5 A

  • Reference Standard:

    UL

  • Termination Type:

    CRIMP

  • Total Number of Contacts:

    12

  • Withdrawl Force-Min:

    13.344 N

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73623-1001 Overview

Use the download button to access the 73623-1001 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 73623, or try a keyword search, such as D Type Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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