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82V3399BNLG - Renesas Electronics

Description: The 82V3399 is an integrated, single-chip solution for the Synchronous Equipment Timing Source for Stratum 3, 4E, 4, SMC, EECOption1, EEC-Option2 clocks in SONET / SDH / Synchronous Ethernet equipment, DWDM and Wireless base station. The device supports several types of input clock sources: recovered clock from Synchronous Ethernet, STM-N or OC-n, PDH network synchronization timing and external synchronization reference timing. The device consists of T0 and T4 paths. The T0 path is a high quality and highly

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Symbol
82V3399BNLG - Renesas Electronics - PCB symbol
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PCB Footprints
82V3399BNLG - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 72-Lead VFQFN--
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3D Models
82V3399BNLG - Renesas Electronics - 3D model - Quad Flat No-Lead - 72-Lead VFQFN--
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82V3399BNLG Details

  • Manufacturer Part Number:

    82V3399BNLG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    72

  • Manufacturer Package Code:

    NLG72P1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • JESD-30 Code:

    S-PQCC-N72

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    72

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC72,.39SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

82V3399BNLG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the PMIC away from high-current paths and ensure good airflow around the device.
  • Use a power-on reset (POR) circuit to ensure the PMIC starts up correctly. For shutdown, use a soft-start circuit to prevent inrush currents and ensure a clean shutdown.
  • Use a common-mode choke, ferrite beads, and Y-capacitors to filter out EMI. Ensure proper PCB layout, grounding, and shielding to minimize radiated emissions.
  • Use the PMIC's built-in power gating and dynamic voltage scaling features. Optimize the system's power domains and use low-power modes for peripherals and cores when not in use.
  • Use a thermal interface material (TIM) and a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good airflow and keep the heat sink away from other heat sources.

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