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89HPES24T3G2ZCALGI - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and two downstream ports or peer-to-peer switching between downstream ports.

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89HPES24T3G2ZCALGI - Renesas Electronics - PCB symbol
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89HPES24T3G2ZCALGI - Renesas Electronics PCB footprint - BGA - BGA - ALG324
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89HPES24T3G2ZCALGI Details

  • Manufacturer Part Number:

    89HPES24T3G2ZCALGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI, SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3.42 mm

  • Supply Current-Max:

    1260 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES24T3G2ZCALGI Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the 89HPES24T3G2ZCALGI, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, power integrity, and thermal dissipation.
  • The 89HPES24T3G2ZCALGI requires a specific power sequencing and voltage regulation scheme. Renesas recommends using a dedicated power management IC (PMIC) or a custom power supply design that meets the device's power requirements. Consult the datasheet and application notes for more information.
  • To minimize EMI and ensure EMC, follow Renesas' guidelines for PCB layout, component placement, and shielding. Additionally, consider using EMI filters, ferrite beads, and other noise-reducing components in your design. Consult the datasheet and application notes for more information.
  • Renesas provides a range of application notes and design guides that offer optimization techniques for specific use cases, such as power management, clocking, and interface configuration. Consult these resources to optimize the device's performance for your specific application.
  • Renesas provides reliability and quality metrics for the 89HPES24T3G2ZCALGI, including MTBF, FIT, and other industry-standard metrics. The device is designed to meet or exceed industry standards for quality and reliability, such as AEC-Q100 and IEC 60747.

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89HPES24T3G2ZCALGI Overview

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