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8SLVP1208ANBGI - Renesas Electronics

Description: The 8SLVP1208 is a high-performance differential LVPECL fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The 8SLVP1208 is characterized to operate from a 3.3V and 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8SLVP1208 ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and eight low skew outputs are

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8SLVP1208ANBGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NBG28
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8SLVP1208ANBGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NBG28
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8SLVP1208ANBGI Details

  • Manufacturer Part Number:

    8SLVP1208ANBGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    28

  • Manufacturer Package Code:

    NBG28

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3.3 V SUPPLY

  • Family:

    8SLVP

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    BGA52,6X10,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.41 ns

  • Propagation Delay (tpd):

    0.41 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.064 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

8SLVP1208ANBGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, add series terminations, and use a common clock domain for all high-speed interfaces. Also, follow the recommended routing guidelines and use a signal integrity analysis tool to simulate and optimize the design.
  • The device requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is: VCC, then VCCIO, and finally VREF. The power-down sequence should be reversed. Ensure that the power supplies are stable and within the recommended voltage ranges.
  • Implement a power management system using a combination of power gating, dynamic voltage and frequency scaling, and clock gating. Use the device's built-in power management features, such as the power modes and clock control registers, to optimize power consumption.
  • To minimize EMI and ensure EMC, use a shielded enclosure, add EMI filters, and follow good PCB design practices such as separating analog and digital circuits, using a solid ground plane, and minimizing loop areas.

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