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A3950SEUTR-T - Allegro Microsystems

Description: DMOS Full Bridge Motor Driver W/Ocp

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PCB Footprints
A3950SEUTR-T - Allegro Microsystems PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - EU Package, 16-Lead QFN with Exposed Thermal Pad
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3D Models
A3950SEUTR-T - Allegro Microsystems  - 3D model - Quad Flat No-Lead - EU Package, 16-Lead QFN with Exposed Thermal Pad
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A3950SEUTR-T Details

  • Manufacturer Part Number:

    A3950SEUTR-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    7.75

  • Analog IC - Other Type:

    FULL BRIDGE BRUSH DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    2.8 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    8.5 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

A3950SEUTR-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the A3950SEUTR-T involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the battery. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the high-current path.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, use a thermal interface material, and ensure good airflow around the device. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.
  • The recommended input capacitor is a 10uF ceramic capacitor with a voltage rating of 25V or higher, and the recommended output capacitor is a 22uF ceramic capacitor with a voltage rating of 25V or higher. The capacitors should be placed as close to the device as possible.
  • The A3950SEUTR-T can be configured using external resistors to set the output voltage and current limit. The device also has an enable input that can be used to turn the device on and off. The datasheet provides a detailed description of how to configure the device for specific applications.
  • To minimize EMI and EMC issues, it's recommended to use a shielded inductor, keep the high-current paths short and away from sensitive circuits, and use a common-mode choke to filter the output. Additionally, the device should be placed in a metal enclosure to reduce radiation.

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A3950SEUTR-T Overview

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