17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PBGA-B256
JESD-609 Code:
e1
Length:
17 mm
Moisture Sensitivity Level:
3
Number of CLBs:
9216
Number of Equivalent Gates:
400000
Number of Terminals:
256
Operating Temperature-Max:
85 °C
Organization:
9216 CLBS, 400000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA256,16X16,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
250
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.8 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
17 mm
A3P400-FGG256 Frequently Asked Questions (FAQs)
Microsemi provides a PCB design guide that includes layout and routing guidelines for the A3P400-FGG256. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA. The FPGA's internal POR circuit can also be used in conjunction with an external voltage supervisor.
The A3P400-FGG256 has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow to keep the device within its recommended operating temperature range. A thermal analysis should be performed to determine the required heat sink size and airflow.
To optimize power consumption, use the FPGA's power management features, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, optimize the design to minimize switching activity, use low-power IP cores, and consider using a low-power FPGA fabric.
The A3P400-FGG256 is designed to withstand the harsh radiation environments found in space and aerospace applications. It features radiation-hardened-by-design (RHBD) architecture, which includes triple-mode redundancy, error correction, and single-event upset (SEU) mitigation. These features ensure reliable operation in high-radiation environments.
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A3P400-FGG256 Overview
Use the download button to access the A3P400-FGG256 schematic symbol, PCB footprint, and 3D model.
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