A3P600-1FGG144 - Microsemi Corporation

A3P600-1FGG144 Details

• Manufacturer Part Number:

  A3P600-1FGG144

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Package Description:

  13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

• HTS Code:

  8542.31.00.60

• Manufacturer:

  Microsemi Corporation (now Microchip)

• Clock Frequency-Max:

  350 MHz

• JESD-30 Code:

  S-PBGA-B144

• JESD-609 Code:

  e1

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  13824

• Number of Equivalent Gates:

  600000

• Number of Terminals:

  144

• Operating Temperature-Max:

  85 °C

• Organization:

  13824 CLBS, 600000 GATES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA144,12X12,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.55 mm

• Supply Voltage-Max:

  1.575 V

• Supply Voltage-Min:

  1.425 V

• Supply Voltage-Nom:

  1.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  13 mm