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A3R12E40DBF-8E - Zentel

Description: DRAM DDR2 512Mb, 32Mx16, 800 @CL5, 1.8V, FBGA-84

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PCB Footprints
A3R12E40DBF-8E - Zentel PCB footprint - BGA - BGA - 84-ball FBGA
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A3R12E40DBF-8E - Zentel  - 3D model - BGA - 84-ball FBGA
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A3R12E40DBF-8E Details

  • Manufacturer Part Number:

    A3R12E40DBF-8E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-84

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.28

  • Manufacturer:

    Zentel Electronics Corp

  • Access Mode:

    FOUR BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B84

  • Length:

    12.5 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    DDR DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    84

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    32MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

A3R12E40DBF-8E Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the A3R12E40DBF-8E is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device can tolerate storage temperatures between -40°C to 125°C.
  • To ensure the reliability of the A3R12E40DBF-8E in high-vibration environments, it's crucial to follow proper mounting and soldering techniques. Additionally, consider using vibration-dampening materials or potting compounds to reduce the impact of vibrations on the device.
  • The maximum allowable power dissipation for the A3R12E40DBF-8E is not explicitly stated in the datasheet. However, based on the device's thermal resistance and maximum junction temperature, it's recommended to keep the power dissipation below 1.5W to ensure reliable operation.
  • While the A3R12E40DBF-8E is designed to operate in a variety of environments, it's not recommended for use in applications with high humidity or moisture. The device is not hermetically sealed, and exposure to moisture can compromise its reliability and performance.
  • The recommended PCB layout and spacing for the A3R12E40DBF-8E are not explicitly stated in the datasheet. However, it's essential to follow general PCB design guidelines for high-frequency devices, including using a solid ground plane, minimizing trace lengths, and maintaining adequate spacing between components.

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