A40MX04-PLG68 footprint, schematic symbol and 3D model by Microchip

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PCB Footprints

A40MX04-PLG68 - Microchip PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLCC68.

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Part Number A40MX04-PLG68
Manufacturer Microchip
Pin Count 68
Part Category Integrated Circuit
Package Category Plastic Leaded Chip Carrier
Footprint Name Plastic Leaded Chip Carrier - PLCC68.
Released Date Jun 19, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

A40MX04-PLG68 Details

Manufacturer Part Number:
A40MX04-PLG68
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
ROHS COMPLIANT, PLASTIC, LCC-68
Pin Count:
68
Manufacturer Package Code:
PLCC-68
Country Of Origin:
Thailand
HTS Code:
8542.31.00.60
Factory Lead Time:
12 Weeks
Manufacturer:
Microchip Technology Inc
YTEOL:
23
Additional Feature:
ALSO OPERATES AT 5V SUPPLY
Clock Frequency-Max:
80 MHz
Combinatorial Delay of a CLB-Max:
2.7 ns
JESD-30 Code:
S-PQCC-J68
JESD-609 Code:
e3
Length:
24.2316 mm
Moisture Sensitivity Level:
3
Number of CLBs:
547
Number of Equivalent Gates:
6000
Number of Inputs:
57
Number of Outputs:
57
Number of Terminals:
68
Operating Temperature-Max:
70 °C
Organization:
547 CLBS, 6000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
QCCJ
Package Equivalence Code:
LDCC68,1.0SQ
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Packing Method:
TUBE
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
4.572 mm
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
J BEND
Terminal Pitch:
1.27 mm
Terminal Position:
QUAD
Width:
24.2316 mm

A40MX04-PLG68 Frequently Asked Questions (FAQs)

The recommended power-on sequence is to apply VCC first, followed by VCCAUX, and then the clock signal. This ensures proper device initialization and prevents potential latch-up conditions.
To optimize power consumption, use the lowest possible voltage and frequency for your application, and consider using the device's power-down modes (e.g., sleep mode) when not in use. Additionally, minimize switching activity and use clock gating to reduce dynamic power consumption.
Follow general high-speed PCB design guidelines: use a solid ground plane, keep signal traces short and direct, avoid vias under the device, and use a consistent impedance for high-speed signals. Also, ensure that the device's thermal pad is properly connected to a solid ground plane.
Implement error detection and correction mechanisms, such as parity checks, CRCs, and error correction codes. Also, use the device's built-in error detection and correction features, such as the Error Correction Code (ECC) for memory protection.
Ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal design guidelines. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.

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A40MX04-PLG68 Overview

Use the download button to access the A40MX04-PLG68 schematic symbol and PCB footprint.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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