SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Current-Max (Isup):
0.01 mA
Supply Voltage-Max (Vsup):
40 V
Supply Voltage-Min (Vsup):
8 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
40
Width:
4.4 mm
A4954ELPTR-T Frequently Asked Questions (FAQs)
A good thermal design should include a solid copper plane on the PCB, connected to the EP pad of the device, to dissipate heat efficiently. The copper plane should be as large as possible and connected to a heat sink or a metal plate to further improve thermal performance.
To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design guidelines, such as using a heat sink, ensuring good airflow, and keeping the device within its recommended operating temperature range (TJ = -20°C to 150°C).
To ensure EMI and EMC compliance, it is crucial to follow proper PCB layout guidelines, such as keeping sensitive analog traces away from noisy digital traces, using shielding, and implementing proper filtering and decoupling techniques.
To troubleshoot issues with the device's output current, check the input voltage, output load, and sense resistor values. Ensure that the device is operated within its recommended specifications, and verify that the output current is within the device's current rating.
To prevent damage, store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
A4954ELPTR-T Overview
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