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A89301GESSR - Allegro Microsystems

Description: Three-Phase Foc BLDC Motor Controller

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A89301GESSR - Allegro Microsystems PCB footprint - Other - Other -  Package ES, 24-pin QFN with exposed thermal pad
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3D Models
A89301GESSR - Allegro Microsystems  - 3D model - Other -  Package ES, 24-pin QFN with exposed thermal pad
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A89301GESSR Details

  • Manufacturer Part Number:

    A89301GESSR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    8.9

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    12 mA

  • Supply Voltage-Max (Vsup):

    50 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

A89301GESSR Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal signal trace length is recommended. Allegro provides a reference design and layout guidelines in their application notes.
  • Allegro provides a configuration tool and software development kit (SDK) to help engineers configure the device for their specific application. The tool allows for customization of parameters such as output voltage, switching frequency, and current limits.
  • The device has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A heat sink or thermal interface material may be required for high-power applications.
  • Allegro provides a troubleshooting guide and diagnostic tools, including a fault detection and reporting mechanism. Engineers can also use oscilloscopes and logic analyzers to debug the device.
  • Yes, the device is designed to meet CISPR 25 Class 5 emissions standards. Engineers should follow Allegro's EMI/EMC guidelines and use shielding, filtering, and layout techniques to minimize emissions and ensure compliance.

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A89301GESSR Overview

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