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AD4022BRMZ - Analog Devices

Description: Analog to Digital Converters - ADC 20-Bit, 0.5 MSPS, Diff, PulSAR ADC

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AD4022BRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-10 (MSOP)
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AD4022BRMZ - Analog Devices  - 3D model - Small Outline Packages - RM-10 (MSOP)
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AD4022BRMZ Details

  • Manufacturer Part Number:

    AD4022BRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-11-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    5.1 V

  • Analog Input Voltage-Min:

    -2.4 V

  • Conversion Time-Max:

    0.35 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G10

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.00031%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    20

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.5 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

AD4022BRMZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the input and output traces short and away from each other. Additionally, use a low-ESR capacitor for the VDD pin and a 0.1uF capacitor for the VREF pin.
  • The AD4022BRMZ is a highly configurable device. To properly configure it, refer to the datasheet and application notes, and consider factors such as input range, gain, and filtering requirements. You may also need to consult with an Analog Devices FAE or a experienced engineer for specific guidance.
  • When selecting external components, consider the device's operating frequency, input impedance, and output drive capability. Choose components with low tolerance, high stability, and suitable temperature coefficients. Additionally, ensure that the components are compatible with the device's voltage and current ratings.
  • To troubleshoot issues with the AD4022BRMZ, start by verifying the power supply and clock signals. Check for proper grounding, decoupling, and bypassing. Use an oscilloscope to inspect the input and output signals, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The AD4022BRMZ has a maximum junction temperature of 150°C. To ensure reliable operation, provide adequate heat sinking, use a thermally conductive package, and avoid excessive power dissipation. Consult the datasheet and thermal management guidelines for specific recommendations.

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AD4022BRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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