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AD4630-24BBCZ - Analog Devices

Description: 24-Bit, 2 MSPS Dual Channel SAR ADC

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AD4630-24BBCZ - Analog Devices PCB footprint - BGA - BGA - 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (05-08-1797)
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3D Models
AD4630-24BBCZ - Analog Devices  - 3D model - BGA - 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (05-08-1797)
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AD4630-24BBCZ Details

  • Manufacturer Part Number:

    AD4630-24BBCZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    05-08-1797

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    5.1289 V

  • Analog Input Voltage-Min:

    -5.0273 V

  • Conversion Time-Max:

    0.3 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PBGA-B64

  • Length:

    7 mm

  • Linearity Error-Max (EL):

    0.00009%

  • Moisture Sensitivity Level:

    4

  • Number of Analog In Channels:

    2

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA64,8X8,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    2 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    192 mm

  • Supply Current-Max:

    11.2 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

AD4630-24BBCZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signals separate. Also, use a low-ESR capacitor for the VDD pin and a 0.1uF capacitor for the AVDD pin. Refer to the AD4630 evaluation board layout as a reference.
  • To optimize performance in high-temperature environments, ensure good thermal management by providing adequate heat sinking and airflow. Also, consider using a thermally conductive material, such as a thermal pad or thermal tape, to improve heat transfer between the device and the heat sink.
  • The recommended power-up sequence is to power up the AVDD pin first, followed by the VDD pin. This ensures that the analog circuitry is powered up before the digital circuitry.
  • To handle the digital output data in a noisy environment, use a low-skew, low-jitter clock source, and consider using a clock domain crossing (CDC) circuit to synchronize the data and clock signals. Also, use a differential signaling scheme, such as LVDS or PECL, to reduce electromagnetic interference (EMI).
  • The recommended method for calibrating the AD4630-24BBCZ is to use the internal calibration mode, which can be initiated by setting the CAL pin high. This mode allows the device to perform a self-calibration routine, which ensures optimal performance.

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AD4630-24BBCZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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